◼︎   LASER  CUTTING  &  LASER  DRILLING  OF  PCD

    Material:     PCD (Poly Crystalline Diamond)

    Processing:     good as-cut surface roughness (Ra < 0.25)

    Typical processing thickness range:     1 - 5 mm


Processing Examples:

    Laser cutting of PCD/WC wafers


Contact us now with your specific request or application idea so we can verify feasibility!

Laser cut-out

Enlarged cross-section of PCD/WC stack

Inclined cut of PCD/WC stack