◼︎ LASER CUTTING & LASER DRILLING OF PCD
➤ Material: PCD (Poly Crystalline Diamond)
➤ Processing: good as-cut surface roughness (Ra < 0.25)
➤ Typical processing thickness range: 1 - 5 mm
➤ Laser cutting of PCD/WC wafers
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Enlarged cross-section of PCD/WC stack
Inclined cut of PCD/WC stack