◼︎ LASER CUTTING & LASER DRILLING OF SILICON
➤ Material: Silicon
➤ Processing: very advantageous with increasing thickness
➤ Typical processing thickness range: 0.1 - 10 mm
➤ Semiconductor wafer cutting / dicing
➤ Silicon power IC cutting
➤ Silicon wafer coring
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Various 10mm thick Silicon parts, all cut out of each other. The cutting gap between the parts is 0.05mm and all parts fit together perfectly.
Freeform cutting through 10mm Silicon
Parts after cutting process
15 x 15mm cut out area, 10mm deep
15 x 15mm cut out with 11mm hole
11mm cylinder with 0.5mm wall
10mm cylinder with 2.5mm wall
10mm cylinder side view
Laser cutting of 10mm thick Silicon
In this video we demonstrate efficient freeform laser cutting of thick silicon using the Avonisys waterjet guided laser process and modern high performance IR fiber lasers.