Material:     Silicon Carbide

    Processing:     good cutting quality

    Typical processing thickness range:     0.5 - 5 mm

Processing Examples:

    Laser cutting of SiC wafers

    Laser (micro-) hole drilling in SiC

Contact us now with your specific request or application idea so we can verify feasibility!

0,5 x 6mm hole in SiC (front side)

Laser cut-out edge

Laser cut-out hole

0,5 x 6mm hole in SiC (back side)

Cross-section of 8mm thick SiC cut out

0,5 - 3,0mm SiC cutting